ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,504, issued on April 29, was assigned to Glatfelter Corp. (Charlotte, N.C.). "Dispersible nonwoven materials including CMC-based binders" wa... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,504, issued on April 29, was assigned to Glatfelter Corp. (Charlotte, N.C.). "Dispersible nonwoven materials including CMC-based binders" wa... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,865, issued on April 29, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Pre-lithiation apparatus" was invented by Seung-Hae ... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,865, issued on April 29, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Pre-lithiation apparatus" was invented by Seung-Hae ... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,695, issued on April 29, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea). "Fe-based nanocrystalline alloy and ele... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,695, issued on April 29, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea). "Fe-based nanocrystalline alloy and ele... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,396, issued on April 29, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Dicarboxylic acid compounds, inorganic particles t... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,396, issued on April 29, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Dicarboxylic acid compounds, inorganic particles t... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,749, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Integrated circuit chip including gate el... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,749, issued on April 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Integrated circuit chip including gate el... Read More